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3D Printed Active Electronic Materials and Devices

Researchers in the Department of Mechanical and Aerospace Engineering at Princeton University have patented the 3D printing of active (semiconductor) electronic materials and devices, based on an extrusion process. The technique allows for printing of devices on flexible sheets, over large areas, in horizontal and vertical configurations, in three-...
Published: 3/29/2018   |   Inventor(s): Michael Mcalpine, Yong Lin Kong
Keywords(s): 3D Printing, semiconductor
Category(s): Ceramics/Material Sciences