Researchers at
Princeton University have developed a new techniques for cleaning and cooling
the cutting wire of a diamond wire saw. Princeton is currently seeking
industrial collaborators to commercialize this technology.
Conventional methods
for cleaning the springs and beads of diamond wire saws use water to clean and
cool the wire. This set up is undesirable where tritium or other contaminants
may be present. This new system uses a non-exotic solid to clear away
particulate matter that may gather in the springs and on the beads of diamond
wire. The method also provides for the cooling of the wire. Both the cutting
speed and life of the diamond wire are improved when the new technique is used.
Additionally, a new brake and torque mechanism has been developed that minimizes
wire failure, and increases wire life many times.
It is anticipated
that this new system can be used in concrete and metal cutting including the
decommissioning of nuclear reactors and other hazardous material
projects.
Patent protection is
pending.
For more information please
contact:
William H. Gowen
Office of Technology Licensing and Intellectual
Property
Princeton University
4
New South Building
Princeton, NJ 08544-0036
(609) 258-6762
(609) 258-1159 fax
wgowen@princeton.edu